Bump Technologies Lands $16,000,000 Series B Financing Round
Jan 11, 2011 • Deals • TechZulu Inc.
| Company Name | Bump Technologies |
| Information Release Date | 1/11/2011 |
| Transaction Type | Venture Equity |
| Amount | $16,000,000 |
| Round | Series B |
| Proceeds Purpose | This round of financing solidifies our priorities to build a world-class engineering and product organization here in Silicon Valley. |
